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                HB20-M1

                FEATURES

                Lead-free compatible Halogen free material

                Lower X,Y/Z-axis CTE

                High Tg(230℃,DMA)

                Keeping high modulus in high temperature

                Good punching & Drilling ability 

                Excellent Anti-CAF resistance

                Excellent in Thickness Uniformity

                Excellent in Refractive index and Color consistency


                APPLICATIONS

                Mini & Micro LED 

                Mini & Micro display(HDI)

                Mini RGB PKG(1010, F1010.etc.)

                IC Package

                Memory


                GENERAL PROPERTIES

                Item

                Test method

                Unit

                HB20-M1

                UL No.

                -

                -

                E136069

                UL Flammability

                UL-94

                -

                V-0

                Min Thickness

                UL

                mm

                0.05

                Tg

                DMA

                230

                Td(5%loss)

                10℃/min@N_2

                390

                T260

                TMA

                min

                >60

                T288

                TMA

                min

                Thermal Stress

                288℃, Solder dip

                -

                6 cycles pass

                Z-axis CTE

                Before Tg

                PPM/

                <25

                After Tg

                PPM/

                150

                50-260

                %

                2.0

                X/Y-axis CTE

                Before Tg

                PPM/

                11-13

                After Tg

                PPM/

                5-10

                Thermal conductivity

                ASTM D5470

                W/(m·k)

                0.5

                Moisture Absorption

                D-24/23

                %

                <0.1

                Dielectric Breakdown

                D-48/50+D-0.5/23

                KV

                45KV/mm

                Dielectric constant

                @1GHz

                -

                4.2

                Dissipation Factor

                @1GHz

                -

                0.007

                Peel Strength

                A

                N/mm

                ≥0.80N/mm(@H oz)

                288℃/10S

                ≥0.80N/mm(@H oz)

                Bending strength (LW/CW)

                A

                Mpa

                480/480

                Volume Resistivity

                After moisture

                MΩ-cm

                E-24/125

                Surface resistivity

                After moisture

                MΩ

                E-24/125

                Young’s modulus

                LW

                Gpa

                28

                CW

                Gpa


                SPECIFICATIONS

                Standard Size

                1041mm*1244mm

                Circuit layer(Electrolytic copper foil)

                12μm

                18μm

                35μm

                70μm

                105μm


                Line up of Core Material

                Thickness(mm)

                Glass fabrics ply

                0.03

                1*1037

                0.04

                1*1067

                0.05

                1*1078

                0.065

                2*1037

                0.07

                2*106

                0.10

                2*1078

                0.15

                3*1078

                0.20

                2*2116

                0.30

                3*2116

                0.40

                4*2116

                0.50

                5*2116

                0.60

                6*2116

                0.80

                8*2116

                1.00

                10*2116

                1.20

                12*2116

                1.50

                8*7628

                 

                Line up of PP material

                Thickness(mm)

                Glass fabrics

                Resin Content

                0.035-0.004mm

                1027

                70%

                0.045-0.05mm

                1037

                71%

                0.055-0.06mm

                1067

                70%

                0.065-0.07mm

                1067

                74%

                0.075-0.08mm

                1078

                65%

                0.085-0.09mm

                1078

                68%

                0.12-0.125mm

                2116

                54%