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                H1170Z
                
				
			
                
			
                
				
                FEATURES
                Very lower Z-CTE
                Low water absorption
                Excellent thermal reliability
                Anti-CAF Capability

                APPLICATIONS
                Automotive,like ECU,BMS,MCU,VCU 
                Power suppliers
                Back panel,Network and other Multilayer PCB
                Industrial

                GENERAL PROPERTIES
                Item
                  IPC-TM-650
                Test Condition
                Unit
                Typical value
                Glass transition temp.
                2.4.25
                DSC
                ℃
                185
                CTE,Z-axis
                2.4.24
                α1，TMA
                ppm/℃
                35
                α2，TMA
                ppm/℃
                184
                50~260℃，TMA
                %
                2
                Decomposition Temp.
                2.4.24.6
                TGA
                ℃
                360
                T288
                2.4.24.1
                TMA,copper clad
                min
                30
                Thermal stress
                2.4.13.1
                Copper clad
                sec
                >120
                unclad
                sec
                >180
                Water absorption
                2.6.2.1
                E-1/105+D-24/23
                %
                0.1
                Peel Strength/18μm
                2.4.8
                as received
                lb/in
                6.5
                after thermal stress
                lb/in
                6.5
                Permittivity(RC50%)
                2.5.5.9
                C-24/23/50,1G
                /
                4.4
                Loss tagent(RC50%)
                2.5.5.9
                C-24/23/50,1G
                /
                0.016
                Volume resistivity
                2.5.17.1
                C-96/35/90
                MΩ·cm
                3.20*108
                Surface resistivity
                2.5.17.1
                C-96/35/90
                MΩ
                9.80*107
                Arc Resistance
                2.5.1
                D48/50+D0.5/23
                sec
                122
                Dielectric Breakdown
                2.5.6
                D48/50+D0.5/23
                kV
                58
                Flexural strength
                Warp
                2.4.4
                as received
                MPa
                565
                Fill
                2.4.4
                as received
                MPa
                455
                Flame resistance
                UL-94
                A&E-24/125
                /
                V0
                CTI
                C-96/20/65
                IEC-60112
                Rating
                PLC3
                 
                u  Specification sheet:IPC-4101/126/101/99/98, for reference only.
                u  Above typical value is tasted from CCL1.0mm 7628*5,except Dk/Df,the typical value is only for reference，cannot be used as the basis for judgement.